PCB Layout measurement

GRID	.020 or 8.333 for thru-hole parts .005, .010 or .025 for surface mount
PIN 1 ON COMPONENTS	.055 SQ. (Comp & Solder Side)
COMPONENT PADS	.055 RD. min. of .020 larger than hole size
COMPONENT HOLES	.033 +/-.003, .039 +/-.003 for .025 sq. pins (e.g. Headers, Connectors)
SOLDERMASK PADS	.065 (.010 larger for wet mask, .005 for dry or L.P.I.
PADS PLANE CLEARANCE	.085 min or .030 larger than hole size. Do not use a pad within a clearance. Remove unused pads on internal line layers. The potential for shorts will be greatly reduced.
THRU-HOLE VIA PADS	.050 Rd.
THRU-HOLE VIA HOLE	.028 +/- .003 separate tool number for easy removal for later test fixture use.
SMT VIA PADS	.028 min., .042 preferred
SMT VIA HOLES	.012 min., .022 preferred
BOARD EDGE PULL BACK ON PLANES	.050
BOARD EDGE PULL BACK ON SOLDERMASK	.025 keep circuitry .050 from board edge.
SIGNAL TRACE	.008 (.012 on loose boards)
PWR & GND TRACES	.050
LINE TO LINE SPACING	.007 (.013 on loose boards)
LINE TO PAD SPACING	.007 on SMT, .008 on thru-hole
PAD TO PAD SPACING	.025 Pad to via and pad to pad spacing should be sufficient to insure soldermask coating between pads. Soldermasks are bigger, so allow enough room between pads for a minimum of .015 coverage.
PAD TO VIA CENTERS	.080
TEXT HEIGHT	.075 min.
TEXT LINE WIDTH	.008 min.
PART OUTLINE WIDTH	.012 min.